NvidiaPatent applicationChips & hardwareInterest 4/10

Nvidia patents split heat sink for easier chip cooling

Patent drawing from the official filing.

Nvidia describes a cooling system made of two separate parts that snap together. One part cools a high-power chip, while the other cools a lower-power component, and when joined, the second part helps spread the heat from the first.

Why it mattersThis design could make it easier to repair or upgrade computer parts by allowing specific cooling sections to be removed without taking apart the entire system.

In the filing’s own words

A heat sink comprises a first section to extract heat generated by a high-power component, and at least a second section, attachable to and detachable from the first section, to extract heat generated by a low-power component. The at least a second section, when attached to the first section, is thermally coupled to the first section such that the heat generated by the high-power component is further dissipated by the at least a second section. The heat sink may correspond to an air-cooled or liquid-cooled heat sink. When liquid-cooled, the heat sink may include cold plates, fluid flow channels, or the like.

What exactly they claim (claim 1)

1. A heat sink, comprising: a first section to extract heat generated by a high-power component; and at least a second section, attachable to and detachable from the first section, to extract heat generated by a low-power component, wherein the at least a second section, when attached to the first section, is thermally coupled to the first section such that the heat generated by the high-power component is further dissipated by the at least a second section.

Facts

Company: Nvidia (NVIDIA Corporation)
Official title: SPLIT HEAT SINK COOLING SYSTEM FOR ENHANCED SERVICEABILITY
Publication number: US20260333639A1
Application number: 19639151
Filed: Apr 4, 2026
Published: Oct 22, 2026
Inventors: 1
Claims: 20

Classified under

H05K 7/2039 Electricity & electronicsH05K 7/20272 Electricity & electronicsH05K 7/20709 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.