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Nvidia patents circuit boards with air pockets for better connector contact

Patent drawing
Patent drawing from the official filing.

Nvidia describes a method for making circuit boards that include small air pockets, or voids, inside the material. These air pockets are positioned directly under specific metal contact points, or finger pads, used to connect the board to other components.

Why it mattersThis is a routine manufacturing improvement that may help ensure reliable electrical connections in Nvidia's hardware, but it does not describe a new consumer feature.

In the filing’s own words

According to certain embodiments, a circuit board is provided. The circuit board includes a circuit board substrate; and a connection finger pad disposed on a first surface of the circuit board substrate. An air void is disposed within the circuit board substrate that is aligned with at least a portion of the connection finger pad. In certain embodiments, a method for fabricating the circuit board is provided.

What exactly they claim (claim 1)

1. A circuit board comprising: a circuit board substrate; and a connection finger pad disposed on a first surface of the circuit board substrate, wherein an air void is disposed within the circuit board substrate that is aligned with at least a portion of the connection finger pad.

Facts

Company
Nvidia (Nvidia Corporation)
Official title
PRINTED CIRCUIT BOARD (PCB) VOIDING FOR CONNECTOR CONTACTS
Publication number
US20260333572A1
Application number
19183109
Filed
Apr 18, 2025
Published
Oct 22, 2026
Inventors
3
Claims
20

Classified under

H05K 1/024 Electricity & electronicsH05K 1/117 Electricity & electronicsH05K 3/0047 Electricity & electronicsH05K 3/4679 Electricity & electronicsH05K 3/4697 Electricity & electronicsH05K 2201/09381 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.