Nvidia patents circuit boards with air pockets for better connector contact
Nvidia describes a method for making circuit boards that include small air pockets, or voids, inside the material. These air pockets are positioned directly under specific metal contact points, or finger pads, used to connect the board to other components.
In the filing’s own words
According to certain embodiments, a circuit board is provided. The circuit board includes a circuit board substrate; and a connection finger pad disposed on a first surface of the circuit board substrate. An air void is disposed within the circuit board substrate that is aligned with at least a portion of the connection finger pad. In certain embodiments, a method for fabricating the circuit board is provided.
What exactly they claim (claim 1)
1. A circuit board comprising: a circuit board substrate; and a connection finger pad disposed on a first surface of the circuit board substrate, wherein an air void is disposed within the circuit board substrate that is aligned with at least a portion of the connection finger pad.
Facts
- Company
- Nvidia (Nvidia Corporation)
- Official title
- PRINTED CIRCUIT BOARD (PCB) VOIDING FOR CONNECTOR CONTACTS
- Publication number
- US20260333572A1
- Application number
- 19183109
- Filed
- Apr 18, 2025
- Published
- Oct 22, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H05K 1/024 Electricity & electronicsH05K 1/117 Electricity & electronicsH05K 3/0047 Electricity & electronicsH05K 3/4679 Electricity & electronicsH05K 3/4697 Electricity & electronicsH05K 2201/09381 Electricity & electronicsMore from Nvidia in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
