Nvidia patents split heat sink that lets you swap out parts
Nvidia describes a cooling system for computer chips that is divided into two separate pieces. One part cools a high-power component, while the other cools a low-power one, and they can be snapped together or taken apart easily.
In the filing’s own words
A heat sink comprises a first section to extract heat generated by a high-power component, and at least a second section, attachable to and detachable from the first section, to extract heat generated by a low-power component. The at least a second section, when attached to the first section, is thermally coupled to the first section such that the heat generated by the high-power component is further dissipated by the at least a second section.
What exactly they claim (claim 1)
1. A heat sink, comprising: a first section to extract heat generated by a high-power component; and at least a second section, attachable to and detachable from the first section, to extract heat generated by a low-power component, wherein the at least a second section, when attached to the first section, is thermally coupled to the first section such that the heat generated by the high-power component is further dissipated by the at least a second section.
Facts
- Company
- Nvidia (NVIDIA Corporation)
- Official title
- SPLIT HEAT SINK COOLING SYSTEM FOR ENHANCED SERVICEABILITY
- Publication number
- US20260333565A1
- Application number
- 19314081
- Filed
- Aug 29, 2025
- Published
- Oct 22, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H05K 1/0203 Electricity & electronicsH05K 2201/064 Electricity & electronicsMore from Nvidia in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
