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Nvidia patents split heat sink that lets you swap out parts

Patent drawing
Patent drawing from the official filing.

Nvidia describes a cooling system for computer chips that is divided into two separate pieces. One part cools a high-power component, while the other cools a low-power one, and they can be snapped together or taken apart easily.

Why it mattersThis design could make it easier for technicians to repair or upgrade specific parts of a computer without removing the entire cooling assembly.

In the filing’s own words

A heat sink comprises a first section to extract heat generated by a high-power component, and at least a second section, attachable to and detachable from the first section, to extract heat generated by a low-power component. The at least a second section, when attached to the first section, is thermally coupled to the first section such that the heat generated by the high-power component is further dissipated by the at least a second section.

What exactly they claim (claim 1)

1. A heat sink, comprising: a first section to extract heat generated by a high-power component; and at least a second section, attachable to and detachable from the first section, to extract heat generated by a low-power component, wherein the at least a second section, when attached to the first section, is thermally coupled to the first section such that the heat generated by the high-power component is further dissipated by the at least a second section.

Facts

Company
Nvidia (NVIDIA Corporation)
Official title
SPLIT HEAT SINK COOLING SYSTEM FOR ENHANCED SERVICEABILITY
Publication number
US20260333565A1
Application number
19314081
Filed
Aug 29, 2025
Published
Oct 22, 2026
Inventors
1
Claims
20

Classified under

H05K 1/0203 Electricity & electronicsH05K 2201/064 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.