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Sony patents chip design to stop light emitters from warping

Patent drawing
Patent drawing from the official filing.

Sony has filed a patent for a specific way to attach light-emitting chips to their baseboards. The design uses a small gap or spacer around the edges of the chip to prevent it from bending or warping during installation.

Why it mattersThis is a routine manufacturing improvement that helps ensure delicate light-emitting components stay flat and functional when built into larger devices.

In the filing’s own words

To provide a surface emitting device that can suppress deformation of a surface emitting element at the time when the surface emitting element is mounted on a mounting substrate. A surface emitting device according to the present technology is a surface emitting device including: a surface emitting element including an element region and a peripheral region around the element region; and a mounting substrate on which the surface emitting element is mounted, in which the element region includes a light emitting element part provided with an electrode on the mounting substrate side, the electrode is bonded to the mounting substrate with a bump interposed between the electrode and the mounting substrate, and the peripheral region and the mounting substrate have a spacer provided between the peripheral region and the mounting substrate.

What exactly they claim (claim 1)

1. A surface emitting device comprising: a surface emitting element including an element region and a peripheral region around the element region; and a mounting substrate on which the surface emitting element is mounted, wherein the element region includes a light emitting element part provided with an electrode on a mounting substrate side, the electrode is bonded to the mounting substrate with a bump interposed between the electrode and the mounting substrate, and the peripheral region and the mounting substrate have a spacer provided between the peripheral region and the mounting substrate.

Facts

Company
Sony (Sony Semiconductor Solutions Corporation)
Official title
SURFACE EMITTING DEVICE AND MANUFACTURING METHOD OF SURFACE EMITTING DEVICE
Publication number
US20260312359A1
Application number
19485011
Filed
May 20, 2024
Published
Oct 8, 2026
Inventors
1
Claims
20

Classified under

H01S 5/02315 Electricity & electronicsH01S 5/04256 Electricity & electronicsH01S 5/183 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.