Sony patents LED chip design to improve connection alignment
Sony describes a light-emitting diode (LED) chip with a specific shape on its backside. The design includes a raised bump that helps align the chip precisely when it is attached to a circuit board.
In the filing’s own words
A surface emitting element having position controllability of a bump when an electrode and a substrate are bonded via the bump is provided. A surface emitting element according to the present technology is a surface emitting element including: a first structure including a first semiconductor structure; a second structure stacked with the first structure and including a second semiconductor structure; and a light emitting layer arranged between the first structure and the second structure and including a light emitting region, in which the second structure further includes an electrode including a bump joint surface on a side opposite to a side of the light emitting layer of the second semiconductor structure, and a convex portion protruding to the side opposite to the side of the light emitting layer more than the bump joint surface is provided. According to the surface emitting element according to the present technology, a surface emitting element having position controllability of a bump when an electrode and a substrate are bonded via the bump is provided.
What exactly they claim (claim 1)
1. A surface emitting element comprising: a first structure including a first semiconductor structure; a second structure stacked with the first structure and including a second semiconductor structure; and a light emitting layer arranged between the first structure and the second structure and including a light emitting region, wherein the second structure further includes an electrode including an external joint surface on a side opposite to a side of the light emitting layer of the second semiconductor structure, and a convex portion protruding to the side opposite to the side of the light emitting layer more than at least a portion of the external joint surface is provided in the second structure.
Facts
- Company
- Sony (Sony Semiconductor Solutions Corporation)
- Official title
- SURFACE EMITTING ELEMENT
- Publication number
- US20260302724A1
- Application number
- 19477652
- Filed
- May 13, 2024
- Published
- Oct 1, 2026
- Inventors
- 10
- Claims
- 29
Classified under
H01S 5/04256 Electricity & electronicsH01S 5/1071 Electricity & electronicsH01S 5/18311 Electricity & electronicsH01S 5/423 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.