Samsung patents pendulum valve for semiconductor processing equipment
Samsung has filed a patent for a pendulum valve apparatus designed for substrate processing equipment. The device uses a swinging pendulum to seal a vent passage and a slit valve to control airflow between two internal spaces within the housing.
In the filing’s own words
A pendulum valve apparatus comprises a housing including a main frame, a cover frame, and a vent passage in the main frame, the vent passage configured to connect to an exhaust line, a pendulum provided in the housing, the pendulum configured to selectively sela the vent passage, and a slit valve between the main frame and the cover frame of the housing. The main frame encloses a first space in the main frame and the cover frame encloses a second space in the cover frame. The slit valve is configured to selectively open and close an aperture of the first space, the aperture of the first space being located between the first space and the second space.
What exactly they claim (claim 1)
1. A pendulum valve apparatus comprising: a housing including a main frame, a cover frame, and a vent passage in the main frame, the vent passage configured to connect to an exhaust line; a pendulum provided in the housing, the pendulum configured to selectively seal the vent passage; and a slit valve between the main frame and the cover frame of the housing, wherein the main frame encloses a first space in the main frame and the cover frame encloses a second space in the cover frame, and wherein the slit valve is configured to selectively open and close an aperture of the first space, the aperture of the first space being located between the first space and the second space.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- PENDULUM VALVE APPARATUS, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND METHOD OF OPERATING PENDULUM VALVE APPARATUS
- Publication number
- US20260298350A1
- Application number
- 19427920
- Filed
- Dec 19, 2025
- Published
- Oct 1, 2026
- Inventors
- 4
- Claims
- 20
Classified under
F16K 3/04 Mechanical engineeringF16K 27/045 Mechanical engineeringF16K 27/12 Mechanical engineeringMore from Samsung in Other
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.