SonyPatent applicationChips & hardwareInterest 3/10

Sony patents chip design that mounts parts on the package frame

Sony describes a semiconductor package where a frame is built around the main chip area on the substrate. This design allows additional electronic components to be mounted directly onto the frame's surface rather than just the flat center area.

Why it mattersThis layout could help engineers fit more parts into a smaller chip package by using the surrounding frame space efficiently.

In the filing’s own words

To reduce the number of components of a mounting substrate in an electronic device including a semiconductor package having a cavity structure. The semiconductor package includes a semiconductor substrate, a first semiconductor chip, and a first component. In this semiconductor package, a frame portion is formed around a predetermined region in one surface of two surfaces of the semiconductor substrate when viewed from a direction perpendicular to the one surface. The first semiconductor chip is mounted on the predetermined region. The first component is mounted on a surface of the frame portion formed on the semiconductor substrate.

What exactly they claim (claim 1)

1. A semiconductor package comprising: a semiconductor substrate in which a frame portion is formed around a predetermined region in one surface of two surfaces when viewed from a direction perpendicular to the one surface; a first semiconductor chip mounted in the predetermined region; and a first component mounted on a surface of the frame portion.

Facts

Company: Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Official title: SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
Publication number: US20260293359A1
Application number: 19473593
Filed: Mar 4, 2024
Published: Sep 24, 2026
Inventors: 1
Claims: 16

Classified under

H10F 39/95 Electricity & electronicsH10F 39/011 Electricity & electronicsH10F 39/804 Electricity & electronicsH10F 39/8057 Electricity & electronicsH10F 39/811 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

More from Sony in Chips & hardware

Sony patents light sensor that adjusts how it counts incoming photons Sep 1, 2026
Sony patents camera sensor with two pixel types for better motion detection Sep 1, 2026
Sony patents game graphics that adjust quality based on hardware heat Sep 8, 2026
Sony patents camera sensor design that stacks chips to shrink pixels Sep 8, 2026
Sony patents chip design that measures internal temperature from outside Sep 8, 2026

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.