Sony patents camera sensor design with better electrical connections
Sony describes a light detection device, likely for camera sensors, that improves how a small chip connects to the main sensor board. The design places the connection point slightly away from the edge of the opening in the protective layer to create a stronger bond.
In the filing’s own words
Provided is a light detection device capable of improving the bondability between a bump electrode and a pad electrode. The light detection device includes: a first substrate portion including a pixel region and a peripheral region located around the pixel region; and a semiconductor chip including a bump electrode. The first substrate portion includes a first semiconductor layer, a photoelectric conversion section provided in the first semiconductor layer in the pixel region, a pad electrode provided in one surface side of the first semiconductor layer in the peripheral region, and an insulating film provided in the one surface side of the first semiconductor layer. The insulating film is provided with a pad opening that opens a portion above the pad electrode. The bump electrode is bonded to the pad electrode in a state of being separated from a peripheral edge portion of an opening end of the pad opening.
What exactly they claim (claim 1)
1. A light detection device comprising: a first substrate portion including a pixel region and a peripheral region located around the pixel region; and a semiconductor chip including a bump electrode, wherein the first substrate portion includes a first semiconductor layer, a photoelectric conversion section provided in the first semiconductor layer in the pixel region, a pad electrode provided in one surface side of the first semiconductor layer in the peripheral region, and an insulating film provided in the one surface side of the first semiconductor layer, the insulating film is provided with a pad opening that opens a portion above the pad electrode, and the bump electrode is bonded to the pad electrode in a state of being separated from a peripheral edge portion of an opening end of the pad opening.
Facts
- Company
- Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- Official title
- LIGHT DETECTION DEVICE
- Publication number
- US20260293356A1
- Application number
- 19477504
- Filed
- Mar 25, 2024
- Published
- Sep 24, 2026
- Inventors
- 2
- Claims
- 16
Classified under
H10F 39/811 Electricity & electronicsH10F 39/809 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.