Sony patents semiconductor design using nitride layers for wireless devices
Sony describes a semiconductor device structure that uses specific layers of nitride semiconductor materials to manage electrical flow. The design includes a channel layer and a barrier layer, with additional semiconductor layers partially buried to improve performance. This setup is intended for use in wireless communication apparatuses.
In the filing’s own words
A semiconductor device according to one embodiment of the present disclosure includes: a substrate; a channel layer including a first nitride semiconductor provided on one surface of the substrate; a barrier layer including a second nitride semiconductor provided on a surface of the channel layer opposite to the substrate; a first semiconductor layer partially buried in the surface of the channel layer opposite to the substrate and being in contact with the barrier layer at at least a part of a side surface; and a second semiconductor layer provided on the first semiconductor layer and having a higher carrier concentration than the first semiconductor layer.
What exactly they claim (claim 1)
1. A semiconductor device, comprising: a substrate; a channel layer including a first nitride semiconductor provided on one surface of the substrate; a barrier layer including a second nitride semiconductor provided on a surface of the channel layer opposite to the substrate; a first semiconductor layer partially buried in the surface of the channel layer opposite to the substrate and being in contact with the barrier layer at at least a part of a side surface; and a second semiconductor layer provided on the first semiconductor layer and having a higher carrier concentration than the first semiconductor layer.
Facts
- Company
- Sony (SONY GROUP CORPORATION)
- Official title
- SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND WIRELESS COMMUNICATION APPARATUS
- Publication number
- US20260293178A1
- Application number
- 19490863
- Filed
- May 16, 2024
- Published
- Sep 24, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H10D 30/471 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.