Sony patents laser chip design that resists stress
Sony describes a semiconductor laser component designed to keep light emission stable even when physical stress is applied to the chip. The design uses a specific curved mirror shape inside the laser structure to help maintain consistent performance under pressure.
In the filing’s own words
Provided is a technique advantageous for stably emitting a desired laser light from a light-emitting unit of a semiconductor light-emitting element even when stress acts on the light-emitting unit. A semiconductor light-emitting element includes a light-emitting unit including a first distributed Bragg reflector and a second distributed Bragg reflector, and a semiconductor layer and an active layer located between the first distributed Bragg reflector and the second distributed Bragg reflector, and generates laser light, and a stress application unit that applies stress to the light-emitting unit, in which the first distributed Bragg reflector has a laser passing portion through which the laser light emitted from the light-emitting unit passes, and the second distributed Bragg reflector includes a concave reflection portion having a concave shape as viewed from the first distributed Bragg reflector.
What exactly they claim (claim 1)
1. A semiconductor light-emitting element comprising: a light-emitting unit including a first distributed Bragg reflector and a second distributed Bragg reflector, and a semiconductor layer and an active layer located between the first distributed Bragg reflector and the second distributed Bragg reflector, and generates laser light; and a stress application unit that applies stress to the light-emitting unit, wherein the second distributed Bragg reflector includes a concave reflection portion having a concave shape as viewed from the first distributed Bragg reflector.
Facts
- Company
- Sony (SONY GROUP CORPORATION)
- Official title
- SEMICONDUCTOR LIGHT-EMITTING ELEMENT
- Publication number
- US20260291178A1
- Application number
- 19475821
- Filed
- Apr 4, 2024
- Published
- Sep 24, 2026
- Inventors
- 3
- Claims
- 18
Classified under
H01S 5/0612 Electricity & electronicsH01S 5/068 Electricity & electronicsH01S 5/18361 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.