Sony patents sensor design to stop camera chips from bending
Sony describes a photodetection device that uses a specific film structure to prevent the chip from warping. The design includes a recess in the semiconductor layer and an opening in the film to improve the device's physical reliability.
In the filing’s own words
To further improve reliability of a photodetection device and an electronic apparatus. A photodetection device includes: a semiconductor layer that has a first surface and a second surface located opposite to each other in a thickness direction; a multilayer wiring layer that is provided on the first surface side of the semiconductor layer; a warpage suppression film that is provided on a side opposite to the semiconductor layer side of the multilayer wiring layer; and a recess that overlaps with the warpage suppression film in plan view and extends from the second surface side of the semiconductor layer to the multilayer wiring layer. Then, the warpage suppression film has an opening in an overlapping region overlapping with the recess in plan view.
What exactly they claim (claim 1)
1. A photodetection device comprising: a semiconductor layer that has a first surface and a second surface located opposite to each other in a thickness direction; a multilayer wiring layer that is provided on the first surface side of the semiconductor layer; a warpage suppression film that is provided on a side opposite to the semiconductor layer side of the multilayer wiring layer; and a recess that overlaps with the warpage suppression film in plan view and extends from the second surface side of the semiconductor layer to the multilayer wiring layer, wherein the warpage suppression film has an opening in an overlapping region overlapping with the recess in plan view.
Facts
- Company
- Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- Official title
- PHOTODETECTION DEVICE AND ELECTRONIC APPARATUS
- Publication number
- US20260282920A1
- Application number
- 19168203
- Filed
- Feb 21, 2024
- Published
- Sep 17, 2026
- Inventors
- 1
- Claims
- 15
Classified under
H10W 42/121 Electricity & electronicsH10F 39/809 Electricity & electronicsH10F 39/811 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.