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MetaPatent applicationChips & hardwareInterest 7/10

Meta patents flexible diamond layer to cool computer chips

Meta has filed a patent for a device that uses a thin, flexible layer of diamond to pull heat away from computer chips. The design places this diamond layer directly over the chip, with both the chip base and the diamond being bendable.

Why it mattersDiamond is a much better conductor of heat than standard materials, so this could help keep powerful processors cooler in thinner or bendable devices.

In the filing’s own words

A device of the subject technology includes at least one semiconductor package formed on a substrate, and a diamond heat spreader arranged over the at least one semiconductor package. The substrate and the diamond heat spreader are flexible.

What exactly they claim (claim 1)

1. A device comprising: at least one semiconductor package formed on a substrate; and a diamond heat spreader arranged over the at least one semiconductor package, wherein the substrate and the diamond heat spreader are flexible.

Facts

Company
Meta (Meta Platforms Technologies, LLC)
Official title
FLEXIBLE DIAMOND HEAT SPREADER
Publication number
US20260282908A1
Application number
19548634
Filed
Feb 24, 2026
Published
Sep 17, 2026
Inventors
1
Claims
20

Classified under

H10W 40/254 Electricity & electronicsH10W 40/251 Electricity & electronicsH10W 40/255 Electricity & electronicsH10W 70/688 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.