Meta patents plastic chip connector that also spreads heat
Meta describes a new type of chip connector made from stacked layers of plastic rather than traditional materials. This design acts as both an electrical bridge and a heat spreader, using laser techniques to create tiny tunnels for connections.
In the filing’s own words
A thermoplastic interposer formed of ordered polymer sheets that may be configured to act as an interconnect and as a thermal energy spreader. In examples, the thermoplastic interposer may include one or more extensions or wings to further dissipate heat. In examples, laser direct structuring (LDS) may be used to form or more through silicon vias (TSVs) or through-chip vias. In examples, the ordered polymer sheets may be extruded via a roll-to-roll process, stacked, and processed to form a laminate interposer structure that makes up the interposer. In examples, the thermoplastic interposer may be used in multi-layer structures interconnecting two or more board assemblies such as printed circuit boards (PCB)s.
What exactly they claim (claim 1)
1. An interposer comprising: a laminate structure comprising two or more thermoplastic ordered polymer layers including a thermoplastic mezzanine element; one or more connection points, each connection point comprising a through chip via; and an internal region relative to an outer boundary of the laminate structure.
Facts
- Company
- Meta (Meta Platforms Technologies, LLC)
- Official title
- Thermoplastic interposer
- Patent number
- US12739965B2
- Application number
- 18378010
- Filed
- Oct 9, 2023
- Granted
- Sep 15, 2026
- Inventors
- 6
- Claims
- 20
Classified under
H05K 1/0209 Electricity & electronicsH05K 1/113 Electricity & electronicsH05K 1/145 Electricity & electronicsH05K 3/368 Electricity & electronicsH05K 2201/10378 Electricity & electronicsMore from Meta in Chips & hardware
- Meta patents flexible diamond layer to cool computer chips Sep 17, 2026
- Meta patents handheld device that mimics controller inputs using motion sensors Sep 24, 2026
- Meta patents display tech that stacks processors under screen pixels Oct 22, 2026
- Meta patents LCD design with angled slits to speed up screen response Sep 29, 2026
- Meta patents heat spreader film to keep displays cool Sep 17, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.