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NvidiaPatent applicationChips & hardwareInterest 4/10

Nvidia patents liquid-cooling plate with dual flow paths for chips

Nvidia describes a metal cover that sits directly on top of electronic components to keep them cool. The design uses a liquid coolant that flows through channels on both the top surface and the side walls to remove heat from the chip.

Why it mattersThis filing details a specific method for improving heat removal in high-performance computing hardware, which is essential for maintaining speed and reliability in data centers.

In the filing’s own words

Examples of a coldplate for thermal management of electronic components are disclosed. In an example, a coldplate apparatus includes a body having a top structure and a sidewall, wherein the top structure and the sidewall form a receiving channel configured to be disposed over an electronic component, wherein the sidewall of the body includes a first opening, a second opening, and a sidewall conduit, wherein the sidewall conduit is configured to allow liquid to flow between the first opening and the second opening, and wherein the top structure includes a plurality of topside conduits that are configured to allow liquid to flow between the first opening and the second opening.

What exactly they claim (claim 1)

1. A coldplate apparatus comprising: a body having a top structure and a sidewall, wherein the top structure and the sidewall form a receiving channel configured to be disposed over an electronic component; wherein the sidewall of the body includes a first opening, a second opening, and a sidewall conduit, wherein the sidewall conduit is configured to allow liquid to flow between the first opening and the second opening; and wherein the top structure includes a plurality of topside conduits that are configured to allow liquid to flow between the first opening and the second opening.

Facts

Company
Nvidia (NVIDIA Corporation)
Official title
COLDPLATE FOR LIQUID COOLING OF AN ELECTRONIC COMPONENT
Publication number
US20260282274A1
Application number
19087014
Filed
Mar 21, 2025
Published
Sep 17, 2026
Inventors
6
Claims
20

Classified under

H05K 7/20254 Electricity & electronicsH05K 7/1424 Electricity & electronicsH05K 7/20272 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.