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SonyPatent applicationChips & hardwareInterest 3/10

Sony patents camera chip design with built-in self-test switch

Sony describes a circuit chip for cameras that includes a special test circuit and a switch. This setup allows the chip to send a known test signal through its normal data lines to check if the components are working correctly.

Why it mattersThis is a routine improvement in manufacturing quality control, ensuring camera sensors are reliable before they leave the factory.

In the filing’s own words

A circuit chip includes a first circuit chip contact area configured to be electrically connected to a first pixel chip contact area of a pixel chip. The circuit chip further includes a first signal line electrically connected to the first circuit chip contact area. The circuit chip further includes a first comparator circuit. The first signal line is electrically coupled to a first input of the first comparator circuit. The circuit chip further includes a first test circuit comprising a digital-to-analog converter circuit. The first test circuit is configured to output a test signal at an output of the first test circuit. The circuit chip further includes a first switching element electrically coupled in series between the output of the first test circuit and the first signal line.

What exactly they claim (claim 1)

1. A circuit chip, comprising: a first circuit chip contact area configured to be electrically connected to a first pixel chip contact area of a pixel chip; a first signal line electrically connected to the first circuit chip contact area; a first comparator circuit, wherein the first signal line is electrically coupled to a first input of the first comparator circuit; a first test circuit comprising a digital-to-analog converter circuit, the first test circuit being configured to output a test signal at an output of the first test circuit; and a first switching element electrically coupled in series between the output of the first test circuit and the first signal line.

Facts

Company
Sony (Sony Semiconductor Solutions Corporation)
Official title
CIRCUIT CHIP AND SOLID-STATE IMAGING DEVICE
Publication number
US20260281592A1
Application number
19162430
Filed
Mar 4, 2024
Published
Sep 17, 2026
Inventors
2
Claims
15

Classified under

H04N 25/79 Electricity & electronicsG01R 31/2884 Physics & computingH04N 17/002 Electricity & electronicsH10F 39/809 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.