Sony patents faster image sensor chip design
Sony describes a design for a chip component that turns light signals into digital data. It uses two separate parts to hold and compare signals at the same time to speed up the process without making the chip physically larger.
In the filing’s own words
Enhanced successive approximation AD converter speed with suppressed increase in circuit size is disclosed. In one example, an analog to digital (AD) converter includes a first digital-to-analog converter (DAC), a second DAC, and a comparison unit. The first DAC has a capacitor that holds a first input signal during a first sampling period, and the second DAC has a capacitor that holds a second input signal during a second sampling period. The comparison unit is connected to the first and second DACs.
What exactly they claim (claim 1)
1. An analog to digital (AD) converter comprising: a first digital-to-analog converter (DAC) having a capacitor that holds a first input signal during a first sampling period; a second DAC connected in parallel with the first DAC and having a capacitor that holds a second input signal during a second sampling period; and a comparison unit connected to the first and second DACS.
Facts
- Company
- Sony (Sony Semiconductor Solutions Corporation)
- Official title
- ANALOG TO DIGITAL (AD) CONVERTER, IMAGING DEVICE, AND METHOD FOR CONTROLLING AD CONVERTER
- Publication number
- US20260281588A1
- Application number
- 19473646
- Filed
- Mar 15, 2024
- Published
- Sep 17, 2026
- Inventors
- 2
- Claims
- 10
Classified under
H04N 25/78 Electricity & electronicsH03M 1/1245 Electricity & electronicsH03M 1/462 Electricity & electronicsH03M 1/468 Electricity & electronicsMore from Sony in Chips & hardware
- Sony patents light sensor that adjusts how it counts incoming photons Sep 1, 2026
- Sony patents camera sensor with two pixel types for better motion detection Sep 1, 2026
- Sony patents game graphics that adjust quality based on hardware heat Sep 8, 2026
- Sony patents camera sensor design that stacks chips to shrink pixels Sep 8, 2026
- Sony patents chip design that measures internal temperature from outside Sep 8, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.