SonyPatent applicationChips & hardwareInterest 4/10

Sony patents board design that connects chips with raised wiring

Sony describes a circuit board design where the wiring layer sticks out from the surface to connect multiple computer chips. This setup aims to make manufacturing easier while keeping the electrical signals strong.

Why it mattersIt is a routine improvement in chip packaging that helps manufacturers build complex processors more efficiently.

In the filing’s own words

To provide a board apparatus including a wiring layer electrically connecting a plurality of dies to each other and capable of improving productivity while suppressing deterioration of electrical characteristics. The board apparatus according to the present technology includes a wiring board and a wiring layer protruding from one surface of the wiring board and electrically connecting a plurality of dies to each other. With the board apparatus according to the present technology, it is possible to provide a board apparatus including a wiring layer electrically connecting a plurality of dies to each other and capable of improving productivity while suppressing deterioration of electrical characteristics.

What exactly they claim (claim 1)

1. A board apparatus, comprising: a wiring board; and a wiring layer protruding from one surface of the wiring board and electrically connecting a plurality of dies to each other.

Facts

Company: Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Official title: BOARD APPARATUS, ELECTRONIC APPARATUS, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Publication number: US20260271761A1
Application number: 19167651
Filed: Feb 19, 2024
Published: Sep 10, 2026
Inventors: 1
Claims: 20

Classified under

H10W 70/686 Electricity & electronicsH10W 70/06 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 70/655 Electricity & electronicsH10W 72/227 Electricity & electronicsH10W 74/15 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.