Sony patents chip package design to boost data speed
Sony describes a semiconductor package where a chip is attached to a metal plate with a hole in it. The design uses a specific arrangement of wires and metal layers to improve how fast data moves through the component.
In the filing’s own words
A high-speed transmission characteristic is improved in a semiconductor package in which a semiconductor chip is connected to a package substrate by a wire. A semiconductor package includes a package substrate, a semiconductor chip, a lead terminal, and a wire. In the package substrate, a wiring layer is stacked on a predetermined surface of a metal plate in which a through-hole is formed. In a semiconductor chip, a connection pad is disposed on a front surface, and a back surface with respect to the front surface is adhered to the metal plate. A height from a surface not in contact with the metal plate out of both surfaces of the wiring layer to a connection point of the lead terminal is higher than a predetermined surface of the metal plate. The wire connects the connection point of the lead terminal and the connection pad.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a package substrate obtained by stacking a wiring layer on a predetermined surface of a metal plate on which a through hole is formed; a semiconductor chip on a front surface of which a connection pad is disposed, the semiconductor chip in which a rear surface with respect to the front surface is adhered to the metal plate; a lead terminal in which a height from a surface not in contact with the metal plate out of both surfaces of the wiring layer to a connection point is higher than the predetermined surface of the metal plate; and a wire that connects the connection point of the lead terminal to the connection pad.
Facts
- Company
- Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- Official title
- SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number
- US20260271752A1
- Application number
- 19166117
- Filed
- Feb 2, 2024
- Published
- Sep 10, 2026
- Inventors
- 1
- Claims
- 17
Classified under
H10W 70/63 Electricity & electronicsH10W 72/019 Electricity & electronicsH10W 72/90 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.