Sony patents chip cooler design that routes power through the cooling plate
Sony describes a Peltier cooler, a device that uses electricity to move heat away from a chip, with a new layout for its internal wiring. The design connects the hot and cold sides of the cooler through the base plates themselves, allowing electrical signals to pass through the material without extra cables. This setup aims to improve cooling efficiency while keeping the connection to the outside simple.
In the filing’s own words
To improve cooling performance of a semiconductor chip cooled by a Peltier element while enabling electrical connection with the outside. The Peltier element includes a thermoelectric element, a heat dissipation substrate that dissipates heat generated by the thermoelectric element, a cooling substrate that is cooled by the thermoelectric element, and an inter-substrate wiring that connects the heat dissipation substrate and the cooling substrate to each other. A spacer substrate provided between the heat dissipation substrate and the cooling substrate may be further included, and the inter-substrate wiring may connect the heat dissipation substrate and the cooling substrate to each other via the spacer substrate. A first through electrode that is connected to the inter-substrate wiring and penetrates the cooling substrate may be further included. A second through electrode that is connected to the inter-substrate wiring and penetrates the heat dissipation substrate may be further included.
What exactly they claim (claim 1)
1. A Peltier element comprising: a thermoelectric element; a heat dissipation substrate that dissipates heat generated by the thermoelectric element; a cooling substrate that is cooled by the thermoelectric element; and an inter-substrate wiring that connects the heat dissipation substrate and the cooling substrate to each other.
Facts
- Company
- Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- Official title
- PELTIER ELEMENT AND SEMICONDUCTOR PACKAGE
- Publication number
- US20260271719A1
- Application number
- 19126615
- Filed
- Sep 19, 2023
- Published
- Sep 10, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10W 40/28 Electricity & electronicsH10W 70/635 Electricity & electronicsH10W 76/153 Electricity & electronicsH10W 90/401 Electricity & electronicsH10W 90/754 Electricity & electronicsH10W 90/794 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.