SonyPatent applicationChips & hardwareInterest 3/10

Sony patents chip design with flat surface for easier connections

Sony describes a semiconductor device where a metal contact pad is placed on a flat insulating layer above the chip. This setup connects the outer pad to internal wiring, creating a smooth surface for attaching other components.

Why it mattersThis design could make it easier to stack or connect chips together, which is a standard step in building more compact electronics.

In the filing’s own words

A semiconductor device according to an embodiment of the present disclosure includes: a semiconductor chip including a first pad, a first wiring, and a first insulating film; a second insulating film provided on the semiconductor chip and having a flat surface; and a second pad provided on the second insulating film and including a metal material. The second pad is electrically coupled to the first pad or the first wiring, and is provided up to the surface of the second insulating film.

What exactly they claim (claim 1)

1. A semiconductor device, comprising: a semiconductor chip including a first pad, a first wiring, and a first insulating film; a second insulating film provided on the semiconductor chip and having a flat surface; and a second pad provided on the second insulating film and including a metal material, wherein the second pad is electrically coupled to the first pad or the first wiring, and is provided up to the surface of the second insulating film.

Facts

Company: Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Official title: SEMICONDUCTOR DEVICE AND LAMINATED STRUCTURE
Publication number: US20260271703A1
Application number: 18876755
Filed: Jun 23, 2023
Published: Sep 10, 2026
Inventors: 1
Claims: 22

Classified under

H10W 20/47 Electricity & electronicsH10F 39/95 Electricity & electronicsH10W 20/075 Electricity & electronicsH10W 20/42 Electricity & electronicsH10W 20/435 Electricity & electronicsH10W 90/26 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

More from Sony in Chips & hardware

Sony patents light sensor that adjusts how it counts incoming photons Sep 1, 2026
Sony patents camera sensor with two pixel types for better motion detection Sep 1, 2026
Sony patents game graphics that adjust quality based on hardware heat Sep 8, 2026
Sony patents camera sensor design that stacks chips to shrink pixels Sep 8, 2026
Sony patents chip design that measures internal temperature from outside Sep 8, 2026

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.