Nvidia patents vapor chamber design for cooling data center chips
Nvidia describes a cooling plate that uses a sealed chamber to move heat away from computer chips. Inside, liquid turns to vapor to carry heat upward, where it is cooled by liquid flowing through specific channels before returning to the bottom.
In the filing’s own words
Cold plate embodiments utilizing a vapor chamber formed with a vapor conduit and top and bottom heat exchangers that direct coolant across surfaces of the vapor chamber to conduct heat away from a device to cool, such as an integrated circuit. The cold plate may receive pumped coolant via multiple low-profile inlet ports, and the coolant may exit the cold plate via multiple low-profile outlet ports.
What exactly they claim (claim 1)
1. A cooling apparatus comprising: a vapor chamber comprising a lower portion, and upper portion, and a vapor conduit configured to enable a convection flow of vapor from the lower portion to the upper portion; a first heat exchanger thermally coupled to the lower portion of the vapor chamber; and a second heat exchanger thermally coupled to the upper portion of the vapor chamber.
Facts
- Company
- Nvidia (NVIDIA Corp.)
- Official title
- VAPOR CHAMBER FOR DATA CENTER COOLING
- Publication number
- US20260271239A1
- Application number
- 19069519
- Filed
- Mar 4, 2025
- Published
- Sep 10, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H05K 7/20609 Electricity & electronicsH05K 7/20254 Electricity & electronicsH05K 7/20272 Electricity & electronicsH05K 7/2039 Electricity & electronicsH05K 7/20654 Electricity & electronicsMore from Nvidia in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.