Sony patents laser chip design with metal film for better insulation
Sony describes an electronic device that pairs a chip containing a semiconductor laser with a separate substrate holding the circuit needed to drive it. The two parts are connected by small metal bumps, while an insulating layer and a metal film are added to separate the connection points and manage the electrical flow.
In the filing’s own words
An electronic device according to an embodiment includes a chip, a semiconductor substrate, bumps, an insulating film, and a metal film. The chip is provided with a semiconductor laser. The semiconductor substrate is provided with a drive circuit that drives the semiconductor laser. The bumps respectively connect a plurality of chip-side connection pads provided on a principal surface of the chip opposite to an emission surface of laser light, and a plurality of substrate-side connection pads provided on a principal surface of the semiconductor substrate on the side opposing the chip. The insulating film is provided in the same layer as the substrate-side connection pads, and insulates between the adjacent substrate-side connection pads. The metal film is provided on the insulating film.
What exactly they claim (claim 1)
1. An electronic device comprising: a chip provided with a semiconductor laser; a semiconductor substrate provided with a drive circuit that drives the semiconductor laser; a plurality of bumps respectively connecting a plurality of chip-side connection pads provided on a principal surface of the chip opposite to an emission surface of laser light, and a plurality of substrate-side connection pads provided on a principal surface of the semiconductor substrate on a side facing the chip; an insulating film that is provided in an identical layer with the substrate-side connection pads and insulates between adjacent substrate-side connection pads among the substrate-side connection pads; and a metal film provided on the insulating film.
Facts
- Company
- Sony (Sony Semiconductor Solutions Corporation)
- Official title
- ELECTRONIC DEVICE
- Publication number
- US20260269559A1
- Application number
- 18995008
- Filed
- Jul 4, 2023
- Published
- Sep 10, 2026
- Inventors
- 1
- Claims
- 7
Classified under
H01S 5/0216 Electricity & electronicsH01S 5/04257 Electricity & electronicsH01S 5/02253 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.