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Sony patents smaller display connections to reduce heat and size

Sony describes a method for connecting a flexible circuit to a display panel using small metal bumps that fuse together. This design aims to make the connection area smaller and lower the electrical resistance, which helps reduce heat buildup in the screen.

Why it mattersThis improvement could help manufacturers build thinner devices with better thermal management, though it is a standard engineering refinement for display components.

In the filing’s own words

An object of the present disclosure is to provide a display and an electronic device capable of miniaturizing the size of an external electrode connecting a flexible printed circuit and a display panel, reducing the resistance of a connection portion between the flexible printed circuit and the display panel, and reducing thermal degradation of the display panel. A display includes: a display panel having a display region in which a light emitting element is disposed and an outer region formed outside the display region; and a flexible printed circuit having connection wiring electrically connected to the display panel, in which the display panel includes an external electrode provided in the outer region and electrically connectable to an outside, a bump electrode is provided on the first structure in a case where one of the external electrode and the connection wiring is a first structure and the other of the external electrode and the connection wiring with respect to the first structure is a second structure, and the bump electrode is metal-bonded to the second structure.

What exactly they claim (claim 1)

1. A display comprising: a display panel having a display region in which a light emitting element is disposed and an outer region formed outside the display region; and a flexible printed circuit having connection wiring electrically connected to the display panel, wherein the display panel includes an external electrode provided in the outer region and electrically connectable to an outside, a bump electrode is provided on the first structure in a case where one of the external electrode and the connection wiring is a first structure and the other of the external electrode and the connection wiring with respect to the first structure is a second structure, and the bump electrode is metal-bonded to the second structure.

Facts

Company
Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Official title
DISPLAY AND ELECTRONIC DEVICE
Publication number
US20260262406A1
Application number
19164598
Filed
Mar 19, 2024
Published
Sep 3, 2026
Inventors
3
Claims
22

Classified under

H10K 59/1315 Electricity & electronicsH10K 59/1201 Electricity & electronicsH10K 59/122 Electricity & electronicsH10K 77/10 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.