/Patent Tracker
SonyPatent applicationChips & hardwareInterest 4/10

Sony patents flexible circuit with holes for easier manufacturing

Sony describes a method for making electronic components on a thin, insulating plastic film. The design includes a metal layer on one side and a hole, or via, that goes all the way through the film to connect the metal to the other side.

Why it mattersThis technique could make flexible electronics easier to produce, which is useful for bendable screens or wearable tech.

In the filing’s own words

Provided is a compact electronic apparatus having an excellent manufacturability. The electronic apparatus includes an insulating film substrate, a thin film device, and a through via. The insulating film substrate includes a first main surface and a second main surface that is on a side opposite to the first main surface. The thin film device includes a metal layer formed on the first main surface of the insulating film substrate. The through via extends from a first part within the metal layer to pass through the insulating film substrate and reach at least the second main surface.

What exactly they claim (claim 1)

1. An electronic apparatus comprising: an insulating film substrate including a first main surface and a second main surface that is on a side opposite to the first main surface; a thin film device including a metal layer formed on the first main surface of the insulating film substrate; and a through via that extends from a first part within the metal layer to pass through the insulating film substrate and reach at least the second main surface.

Facts

Company
Sony (Sony Group Corporation)
Official title
ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING APPARATUS, AND DISPLAY APPARATUS
Publication number
US20260262356A1
Application number
18863645
Filed
May 15, 2023
Published
Sep 3, 2026
Inventors
1
Claims
16

Classified under

H10H 29/853 Electricity & electronicsH10H 29/0362 Electricity & electronics

More from Sony in Chips & hardware

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.