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SonyPatent applicationChips & hardwareInterest 4/10

Sony patents camera sensor design with stepped trenches for better wiring

Sony has filed a patent for a photodetection device, which is the core component of digital camera sensors. The design features a stepped trench structure between the light-sensing pixels, where a wider channel connects to a narrower one to create a specific electrical path. This arrangement allows for a more straightforward way to form a negative bias circuit within the sensor's silicon substrate.

Why it mattersThis is a technical improvement to camera sensor manufacturing that could help engineers build more efficient image sensors, though it does not guarantee a new consumer product.

In the filing’s own words

There is provided a photodetection device capable of relatively easily forming a transmission path of a negative bias. Specifically, a through-trench portion is provided in a region between photoelectric conversion portions of a conductor substrate. Then, a through-trench portion has a first trench portion that is formed on a back surface side of a semiconductor substrate and has an opening portion on the back surface, and a second trench portion that is formed on a front surface side opposite to the back surface and has opening portions respectively on a bottom surface of the first trench portion and the front surface. Furthermore, a width of the first trench portion is wider than a width of the second trench portion. Furthermore, the photodetection device further includes a second conductor portion that is arranged in the second trench portion and includes a second conductor, an insulating film arranged between an inner side surface of the second trench portion and the second conductor portion, and a first conductor portion that is arranged in the first trench portion, is in contact with an end portion of the second conductor portion on the back surface side, and includes a first conductor.

What exactly they claim (claim 1)

1. A photodetection device comprising: a semiconductor substrate; a plurality of photoelectric conversion portions formed in a two-dimensional array on the semiconductor substrate; a plurality of microlenses arranged on a first surface side as a light receiving surface of the semiconductor substrate; and a through-trench portion that is formed in at least a part of a region between the photoelectric conversion portions of the semiconductor substrate and penetrates the semiconductor substrate in a thickness direction of the semiconductor substrate, wherein the through-trench portion has a first trench portion that is formed on the first surface side of the semiconductor substrate and has an opening portion on the first surface, and a second trench portion that is formed on a second surface side opposite to the first surface and has opening portions respectively on a bottom surface of the first trench portion and the second surface, a width of the first trench portion is wider than a width of the second trench portion, and the photodetection device further comprises a first conductor portion that is arranged in the first trench portion and includes a first conductor; a second conductor portion which is arranged in the second trench portion, of which an end portion on the first surface side is in contact with the first conductor portion, and which includes a second conductor different from the first conductor; and an insulating film arranged between an inner side surface of the second trench portion and the second conductor portion.

Facts

Company
Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Official title
PHOTODETECTION DEVICE AND ELECTRONIC APPARATUS
Publication number
US20260262313A1
Application number
18878890
Filed
May 29, 2023
Published
Sep 3, 2026
Inventors
3
Claims
36

Classified under

H10F 39/807 Electricity & electronicsH10F 39/014 Electricity & electronicsH10F 39/182 Electricity & electronicsH10F 39/8057 Electricity & electronicsH10F 39/806 Electricity & electronicsH10F 39/8063 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.