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Sony patents camera sensor design to prevent glass cracks

Sony has filed a patent for a camera sensor package that adds a protective layer over the sharp edges of the glass covering the sensor. This design aims to stop the glass from cracking by shielding the vulnerable ridge line where stress often builds up.

Why it mattersThis improvement could make the camera sensors in phones and cameras more durable against physical stress or manufacturing flaws.

In the filing’s own words

An object of the present technology is to enhance the durability of a sealing glass in an imaging element package having a sealed structure achieved by the sealing glass. This imaging element package includes: a solid-state imaging element; a substrate where the solid-state imaging element is mounted; a sealing glass fixed to an imaging surface side of the solid-state imaging element; and a protection member that covers a ridge line of an upper surface of the sealing glass. The protection member covers the ridge line of the upper surface of the sealing glass to reduce the risk of crack formation in the sealing glass. The protection member may be a sealing resin per se, or may be provided separately from a sealing resin and arranged between the sealing resin and the solid-state imaging element. In the latter case, the protection member is expected to include, for example, a low-elasticity resin.

What exactly they claim (claim 1)

1. An imaging element package comprising: a solid-state imaging element; a substrate where the solid-state imaging element is mounted; a transparent member fixed to an imaging surface side of the solid-state imaging element; and a protection member that covers a ridge line of an upper surface of the transparent member.

Facts

Company
Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Official title
IMAGING ELEMENT PACKAGE AND METHOD FOR MANUFACTURING SAME
Publication number
US20260262310A1
Application number
19163554
Filed
Feb 5, 2024
Published
Sep 3, 2026
Inventors
8
Claims
20

Classified under

H10F 39/804 Electricity & electronicsH10F 39/014 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.