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SonyPatent applicationChips & hardwareInterest 4/10

Sony patents chip test tool that adds errors to check reliability

Sony has filed a patent for a transmission device that connects to other chips using a standard called MIPI. The device intentionally inserts small errors into data packets at specific spots to test how well the connection handles mistakes.

Why it mattersThis helps engineers verify that computer chips can reliably send data without failing, which is a routine but important step in making sure electronics work correctly.

In the filing’s own words

The present disclosure relates to a transmission apparatus and a transmission method each making it possible to achieve reproducible evaluation. The transmission apparatus includes a transmission unit that transmits and receives packets to and from another transmission apparatus coupled via an A-PHY I/F defined in a MIPI standard. The transmission unit includes a first insertion section that inserts an error in a specific position of a specific transmission packet, out of transmission packets to be transmitted to the other transmission apparatus, based on a first parameter preset. The present disclosure is applicable to the transmission apparatus in accordance with the MIPI standard, for example.

What exactly they claim (claim 1)

1. A transmission apparatus comprising a transmission unit that transmits and receives packets to and from another transmission apparatus coupled via an A-PHY I/F defined in a MIPI standard, wherein the transmission unit includes a first insertion section that inserts an error in a specific position of a specific transmission packet, out of transmission packets to be transmitted to the another transmission apparatus, based on a first parameter preset.

Facts

Company
Sony (Sony Semiconductor Solutions Corporation)
Official title
TRANSMISSION APPARATUS AND TRANSMISSION METHOD
Publication number
US20260261528A1
Application number
19163190
Filed
Apr 2, 2024
Published
Sep 3, 2026
Inventors
2
Claims
12

Classified under

H04L 49/555 Electricity & electronicsH04L 49/557 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.