Sony patents chip test tool that adds errors to check reliability
Sony has filed a patent for a transmission device that connects to other chips using a standard called MIPI. The device intentionally inserts small errors into data packets at specific spots to test how well the connection handles mistakes.
In the filing’s own words
The present disclosure relates to a transmission apparatus and a transmission method each making it possible to achieve reproducible evaluation. The transmission apparatus includes a transmission unit that transmits and receives packets to and from another transmission apparatus coupled via an A-PHY I/F defined in a MIPI standard. The transmission unit includes a first insertion section that inserts an error in a specific position of a specific transmission packet, out of transmission packets to be transmitted to the other transmission apparatus, based on a first parameter preset. The present disclosure is applicable to the transmission apparatus in accordance with the MIPI standard, for example.
What exactly they claim (claim 1)
1. A transmission apparatus comprising a transmission unit that transmits and receives packets to and from another transmission apparatus coupled via an A-PHY I/F defined in a MIPI standard, wherein the transmission unit includes a first insertion section that inserts an error in a specific position of a specific transmission packet, out of transmission packets to be transmitted to the another transmission apparatus, based on a first parameter preset.
Facts
- Company
- Sony (Sony Semiconductor Solutions Corporation)
- Official title
- TRANSMISSION APPARATUS AND TRANSMISSION METHOD
- Publication number
- US20260261528A1
- Application number
- 19163190
- Filed
- Apr 2, 2024
- Published
- Sep 3, 2026
- Inventors
- 2
- Claims
- 12
Classified under
H04L 49/555 Electricity & electronicsH04L 49/557 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.