Nvidia patents chip cooling that mixes micro-channels and cold plates
Nvidia describes a cooling system for computer chips that uses two different methods to handle heat. It directs a cooling fluid through tiny channels etched directly into the hottest chip, then routes that fluid to a separate cold plate to cool a second, cooler component.
In the filing’s own words
Devices, apparatuses, systems, and methods are provided for hybrid thermal management in computing modules. An example computing module includes a first computing component having a first operating temperature and a second computing component having a second operating temperature. The first operating temperature is greater than the second operating temperature. The example computing module further includes a hybrid thermal management system including a cooling delivery device configured to receive a cooling fluid. The cooling delivery device defines a first section configured to dissipate heat generated by the first computing component and a second section configured to dissipate heat generated by the second computing component. The first section of the cooling delivery device may be fluidically isolated from the second section of the cooling delivery device or the second section may be in fluid communication with the first section.
What exactly they claim (claim 1)
1. A computing module comprising: a first computing component having a first operating temperature; a second computing component having a second operating temperature, wherein the first operating temperature is greater than the second operating temperature; and a hybrid thermal management system comprising: a cooling delivery device configured to receive a cooling fluid, the cooling delivery device defining: a first section configured to dissipate heat generated by the first computing component; and a second section configured to dissipate heat generated by the second computing component, wherein the first section comprises one or more microfluidic channels formed into a surface of a die of the first computing component, the one or more microfluidic channels comprising a distribution channel configured to reduce a pressure drop and a cooling channel configured to increase a heat transfer from the first computing component; and the second section comprises a cold plate fluidically coupled to an exhaust of the first section.
Facts
- Company
- Nvidia (NVIDIA CORPORATION)
- Official title
- Computing modules with hybrid thermal management
- Patent number
- US12772413B2
- Application number
- 18369917
- Filed
- Sep 19, 2023
- Granted
- Oct 20, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H05K 7/20272 Electricity & electronicsG06F 1/20 Physics & computingMore from Nvidia in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.