Sony patents chip design with alternating gaps to manage heat stress
Sony has been granted a patent for a semiconductor structure that places small insulating barriers between metal wires on the back of a chip. These barriers are spaced out in a specific pattern, with wider gaps between them where the wires are packed more closely together.
In the filing’s own words
A semiconductor device includes a semiconductor substrate, a wiring layer including an electrode pad, the wiring layer formed on a first surface of the semiconductor substrate, a redistribution layer including wiring electrically connected to the electrode pad via a via, the redistribution layer formed on a second surface side opposite to the first surface of the semiconductor substrate, a protective film formed on a surface on a side opposite to the semiconductor substrate in the redistribution layer, and a partition formed by an insulating material, the partition arranged between pieces of wiring in the redistribution layer, in which the partition and a void are alternately formed between the pieces of wiring in a direction in which the wiring extends.
What exactly they claim (claim 1)
1. A semiconductor device, comprising: a semiconductor substrate; a wiring layer including an electrode pad, the wiring layer formed on a first surface of the semiconductor substrate; a redistribution layer including wiring electrically connected to the electrode pad via a via, the redistribution layer formed on a second surface side opposite to the first surface of the semiconductor substrate; a protective film formed on a surface on a side opposite to the semiconductor substrate in the redistribution layer; and a partition formed by an insulating material, the partition arranged between pieces of wiring in the redistribution layer, wherein the partition and a void are alternately formed between the pieces of wiring in a direction in which the wiring extends, wherein two pieces of wiring having a first inter-wiring distance and two pieces of wiring having a second inter-wiring distance are formed in the redistribution layer, wherein the first inter-wiring distance is made shorter than the second inter-wiring distance, and wherein an interval between partitions arranged between the two pieces of wiring having the first inter-wiring distance, the partitions adjacent to each other in a direction in which the wiring extends is made larger than an interval between the partitions arranged between the two pieces of wiring having the second inter-wiring distance, the partitions adjacent to each other in a direction in which the wiring extends.
Facts
- Company
- Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- Official title
- Semiconductor device with partition portions and gaps alternately formed between wirings in a wiring extending direction
- Patent number
- US12765348B2
- Application number
- 18550284
- Filed
- Feb 18, 2022
- Granted
- Oct 13, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H10W 20/20 Electricity & electronicsH10W 20/43 Electricity & electronicsH10W 70/60 Electricity & electronicsH10W 70/65 Electricity & electronicsH10W 70/68 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.