Sony patents stacked camera sensor design with mixed-size layers
Sony describes a camera sensor structure that stacks three different layers of material together. The middle layer is a different size than the bottom layer, and an insulating layer fills the gap between them to improve the device's overall quality.
In the filing’s own words
To provide a solid-state imaging device capable of further improving quality and reliability of the solid-state imaging device. Provided is a solid-state imaging device including: a first substrate; a second substrate laminated on the first substrate by direct bonding on a side opposite to a light incident side of the first substrate, the second substrate having a size different from a size of the first substrate; a third substrate provided on a side opposite to a light incident side of the second substrate; and an insulating layer formed between the first substrate and the third substrate, in which the third substrate includes a well formed on a light incident side of the third substrate.
What exactly they claim (claim 1)
1. A solid-state imaging device, comprising: a first substrate; a second substrate laminated on the first substrate by direct bonding on a side opposite to a light incident side of the first substrate, the second substrate having a size different from a size of the first substrate; a third substrate provided on a side opposite to a light incident side of the second substrate; and an insulating layer formed between the first substrate and the third substrate, wherein the third substrate includes a well formed on a light incident side of the third substrate, wherein the third substrate is in contact with the second substrate, and wherein the third substrate is in contact with the insulating layer.
Facts
- Company
- Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- Official title
- Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic device
- Patent number
- US12765105B2
- Application number
- 18248951
- Filed
- Sep 15, 2021
- Granted
- Oct 13, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10F 39/811 Electricity & electronicsH10F 39/018 Electricity & electronicsH10F 39/809 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.