Sony patents image sensor design with protective covers and precise alignment pins
Sony has been granted a patent for an image sensor device that uses a translucent cover to shield pixel chips from damage and contamination during manufacturing. The design also includes a specific positioning structure with pins and bolts to ensure the sensor units are aligned correctly on the main substrate.
In the filing’s own words
It is a main object to provide an image sensor device that can reduce the risks of damage to and/or contamination of its components during manufacturing. The image sensor device according to the present technology is an image sensor device including a substrate and a plurality of sensor units arranged in at least one axis direction on the substrate. Each of the plurality of sensor units includes a pixel chip including a plurality of pixels, and a translucent cover configured to cover the pixel chip. With the image sensor device according to the present technology, there can be provided an image sensor device that can reduce the risks of damage to and/or contamination of its components during manufacturing.
What exactly they claim (claim 1)
1. An image sensor device, comprising: a first substrate; a plurality of sensor units in at least one axis direction on the first substrate, wherein the at least one axis direction is with respect to the first substrate, and each sensor unit of the plurality of sensor units includes: a second substrate; a pixel chip on the second substrate, wherein the pixel chip includes a plurality of pixels; and a translucent cover configured to cover the pixel chip; and a positioning structure configured to position the first substrate and a corresponding sensor unit of the plurality of sensor units, wherein the positioning structure includes: a pin; a first bolt insertion hole in the first substrate; a pin insertion hole in each of the first substrate and the second substrate, wherein a first end portion of the pin is in the pin insertion hole of the first substrate, and a second end portion of the pin is inserted through the pin insertion hole of the second substrate; a second bolt insertion hole in the second substrate, wherein the second bolt insertion hole is at a position corresponding to the first bolt insertion hole of the first substrate; a bolt in each of the first bolt insertion hole and the second bolt insertion hole; and a nut that is threadedly engaged with the bolt.
Facts
- Company
- Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- Official title
- Image sensor device, equipment, and method of manufacturing image sensor device
- Patent number
- US12765085B2
- Application number
- 18714114
- Filed
- Oct 13, 2022
- Granted
- Oct 13, 2026
- Inventors
- 1
- Claims
- 19
Classified under
H10F 39/802 Electricity & electronicsH10F 39/026 Electricity & electronicsH10F 39/811 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.