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Nvidia patents silicon inductors with embedded magnetic material

Nvidia describes a method for building inductors by embedding magnetic material directly into a silicon block before slicing it into wafers. The process creates holes around the magnetic core and connects metal pads to guide current in a circular path around the material.

Why it mattersThis technique could help manufacturers create more compact components for computer chips, though it is a specific manufacturing detail unlikely to change how users interact with their devices.

In the filing’s own words

A process for manufacturing inductors for use in integrated circuits includes embedding ferromagnetic material in a bulk silicon substrate, forming a plurality of vias in the bulk silicon substrate such that the vias bracket a volume of the bulk silicon substrate that includes the ferromagnetic material, slicing the bulk silicon substrate to form a silicon wafer, and configuring traces between top metal pads of the vias and between bottom metal pads of the vias to form a continuous path for current to flow circumferentially from a first end of the volume to a second end of the volume.

What exactly they claim (claim 1)

1. A method comprising: embedding ferromagnetic material in a bulk silicon substrate; forming a plurality of vias in the bulk silicon substrate such that the vias bracket a volume of the bulk silicon substrate comprising the ferromagnetic material; slicing the bulk silicon substrate to form a silicon wafer; and configuring traces between top metal pads of the vias and between bottom metal pads of the vias to form a continuous path for current to flow circumferentially from a first end of the volume to a second end of the volume.

Facts

Company
Nvidia (NVIDIA Corp.)
Official title
Ferromagnetic material based integrated inductor in silicon
Patent number
US12751021B2
Application number
18313535
Filed
May 8, 2023
Granted
Sep 29, 2026
Inventors
2
Claims
16

Classified under

H10D 1/20 Electricity & electronicsH01F 27/2823 Electricity & electronicsH01F 41/02 Electricity & electronicsH10W 70/635 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.