Sony patents chip that pairs millimeter wave antenna with camera sensor
Sony has been granted a patent for a semiconductor device that places a millimeter wave antenna and an image sensor on the same base. The design positions the antenna higher than the camera lens and uses a special layer with holes to connect the parts, which helps with calibration.
In the filing’s own words
The present invention relates to a semiconductor device and an electronic device that facilitate calibration and can obtain favorable characteristics. The semiconductor device includes a substrate, a millimeter wave antenna provided on the substrate, and an image sensor provided on the substrate, in which an antenna surface of the millimeter wave antenna and a light receiving surface of the image sensor are disposed at spatially partitioned positions. The present technology can be applied to a sensor module.
What exactly they claim (claim 1)
1. A semiconductor device, comprising: a substrate; a module including a millimeter wave antenna provided on the substrate; an image sensor provided on the substrate, wherein an antenna surface of the millimeter wave antenna and a light receiving surface of the image sensor are disposed at spatially partitioned positions, wherein the antenna surface is disposed at a position further away from the substrate than the image sensor in a direction perpendicular to the substrate; and a bottom-raising substrate that is disposed between the substrate and the module, wherein the bottom-raising substrate has a plurality of through holes formed therein, and wherein each of a plurality of the through holes is a through hole for transmission of an input signal to the module, for transmission of an output signal from the module, or for power supply.
Facts
- Company
- Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- Official title
- Semiconductor device and electronic device
- Patent number
- US12744305B2
- Application number
- 18548661
- Filed
- Mar 2, 2022
- Granted
- Sep 22, 2026
- Inventors
- 3
- Claims
- 14
Classified under
H01Q 1/2283 Electricity & electronicsH01Q 9/0407 Electricity & electronicsH10F 39/804 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.