Sony patents camera chip with fiber-reinforced resin to prevent image blur
Sony has been granted a patent for a semiconductor chip design that protects CMOS image sensors using a special sealing resin. This resin contains tiny fibrous materials that are stronger than the base material, helping the chip withstand stress without warping. By keeping the sensor stable, the technology aims to maintain clear image quality over time.
In the filing’s own words
The present technology relates to a semiconductor chip of an imaging element, a method of manufacturing the semiconductor chip, a semiconductor device, a method of manufacturing the semiconductor device, and an electronic device, which are capable of suppressing image quality deterioration of a captured image while securing long-term reliability after mounting of the substrate. The semiconductor chip includes a CMOS image sensor, a sealing resin formed on the CMOS image sensor, and a protective substrate bonded to the CMOS image sensor via the sealing resin. The sealing resin includes a base material and a reinforcing material having a Young's modulus or breaking strength higher than that of the base material. The present technology can be applied to, for example, a semiconductor chip of a CMOS image sensor or the like.
What exactly they claim (claim 1)
1. A semiconductor chip, comprising: an imaging element; a sealing resin formed on the imaging element; and a protective substrate bonded to the imaging element via the sealing resin, wherein the sealing resin includes a base material and a reinforcing material having a Young's modulus or breaking strength higher than that of the base material, wherein the reinforcing material is fibrous, and wherein, in the reinforcing material, a diameter of a cross section of a short side is shorter than a wavelength of visible light, and a diameter of a cross section of a long side is three times or more a cross-sectional diameter of the short side.
Facts
- Company
- Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- Official title
- Semiconductor chip and manufacturing method therefor, semiconductor device and manufacturing method therefor, and electronic device
- Patent number
- US12740169B2
- Application number
- 18551169
- Filed
- Jan 21, 2022
- Granted
- Sep 15, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10F 39/804 Electricity & electronicsH10F 39/011 Electricity & electronicsH10F 39/8063 Electricity & electronicsH10W 72/072 Electricity & electronicsH10W 72/073 Electricity & electronicsH10W 74/15 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.