Sony patents airflow valve using a flexible plate to control air flow
Sony has been granted a patent for a mechanical device that controls airflow using two rotating frames and a flexible plate. As the frames rotate relative to each other, the plate bends to change how much air can pass through the system.
In the filing’s own words
An airflow control apparatus according to an embodiment of the present technology includes a first frame, a second frame, and a rectifying plate. The first frame is located about the center of rotation and includes a through-hole. The second frame is located, about the center of rotation, on an outer circumference side relative to the first frame. The rectifying plate is flexible, has one end fixed to the center of rotation and another end fixed to the second frame, passes through the through-hole, and changes an amount of deflection of a portion between the through-hole and the center of rotation according to a change in a length of the portion by relative rotation of the first frame and the second frame about the center of rotation.
What exactly they claim (claim 1)
1. An airflow control apparatus, comprising: a first frame that is located about a center of rotation and includes a through-hole; a second frame that is located, about the center of rotation, on an outer circumference side relative to the first frame; and a rectifying plate that is flexible, has one end fixed to the center of rotation and another end fixed to the second frame, passes through the through-hole, and changes an amount of deflection of a portion between the through-hole and the center of rotation according to a change in a length of the portion by relative rotation of the first frame and the second frame about the center of rotation.
Facts
- Company
- Sony (SONY GROUP CORPORATION)
- Official title
- Airflow control apparatus, airflow control system, and airflow control method
- Patent number
- US12736064B2
- Application number
- 19104357
- Filed
- Aug 1, 2023
- Granted
- Sep 15, 2026
- Inventors
- 4
- Claims
- 19
Classified under
F04D 29/563 Mechanical engineeringF04D 25/08 Mechanical engineeringMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.