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SonyGranted patentChips & hardwareInterest 4/10

Sony patents chip design using light-sensitive layers to shape internal wires

Sony has been granted a patent for a semiconductor device that uses a specific layering technique to create vertical connections, or through holes, in a silicon chip. The design places a photosensitive film over a base film on the side of these holes, which helps control the shape of the electrical pathways within the device.

Why it mattersThis is a detailed manufacturing improvement for making computer chips, which may help create more precise internal structures for future electronics.

In the filing’s own words

Provided are a semiconductor device capable of constituting a through electrode having a desired shape, an electronic device, and a method for manufacturing a semiconductor device. The semiconductor device includes a first substrate including silicon, a first film formed on at least some surfaces of a hole-shaped portion formed in the first substrate, and a photosensitive second film covering at least a part of a side surface of the hole-shaped portion with the first film interposed therebetween.

What exactly they claim (claim 1)

1. A semiconductor device, comprising: a first substrate that includes: silicon; a semiconductor substrate that includes a hole-shaped portion; and a multilayer wiring layer connected to the semiconductor substrate, wherein the hole-shaped portion is a through hole that penetrates the multilayer wiring layer from a surface of the semiconductor substrate, and the multilayer wiring layer includes a logic circuit; a first film on at least one surface of the hole-shaped portion; a photosensitive second film that covers at least a part of a side surface of the hole-shaped portion, wherein the at least one surface of the hole-shaped portion includes the side surface of the hole-shaped portion, and the first film is between the side surface of the hole-shaped portion and the photosensitive second film; and a second substrate includes a pixel region, wherein the pixel region includes pixel units, and the second substrate is different from the first substrate.

Facts

Company
Sony (SONY GROUP CORPORATION)
Official title
Semiconductor device, electronic device, and method for manufacturing semiconductor device
Patent number
US12733285B2
Application number
18260255
Filed
Dec 22, 2021
Granted
Sep 8, 2026
Inventors
2
Claims
15

Classified under

H10F 39/811 Electricity & electronicsH10F 39/018 Electricity & electronicsH10F 39/024 Electricity & electronicsH10F 39/8057 Electricity & electronicsH10F 39/809 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.