Sony patents laser design that lowers electrical resistance
Sony describes a surface emitting laser device that uses two stacked boards to connect light-emitting units to wiring lines. The design features specific wiring paths and connection points, or bumps, intended to reduce electrical resistance within the device.
In the filing’s own words
The present technology provides a surface emitting laser device capable of reducing resistance. The present technology provides a surface emitting laser device including: a first wiring group including a plurality of first wiring lines insulated from each other; a second wiring group including a plurality of second wiring lines insulated from each other; a first board provided with a plurality of light emitting units electrically connected to any one of the plurality of first wiring lines and electrically connected to any one of the plurality of second wiring lines; and a second board disposed to face the first board and provided with the first wiring group and/or the second wiring group.
What exactly they claim (claim 1)
1. A surface emitting laser device, comprising: a first wiring group including a plurality of first wiring lines insulated from each other; a second wiring group including a plurality of second wiring lines insulated from each other; a first board including a plurality of light emitting units electrically connected to one of the plurality of first wiring lines and electrically connected to one of the plurality of second wiring lines; and a second board that faces the first board and includes at least one of the first wiring group or the second wiring group, wherein each of the plurality of light emitting units is joined to a corresponding wiring line of a wiring group provided on the second board among the first wiring group and the second wiring group, each of the plurality of light emitting units has a mesa protruding toward the second board, a first electrode provided at a top portion of the mesa of each light emitting unit among the plurality of light emitting units is joined via a first bump to a corresponding first wiring line of the plurality of first wiring lines, a second electrode provided in a peripheral portion of each light emitting unit among the plurality of light emitting units on the first board is joined via a second bump to a corresponding second wiring line of the plurality of second wiring lines, and each of the plurality of second wiring lines includes: a first portion provided along the first board; and a second portion provided along a pedestal portion on the first board, wherein the second portion of each of the plurality of second wiring lines is joined via the second bump to the corresponding wiring line provided on the second board.
Facts
- Company
- Sony (SONY GROUP CORPORATION)
- Official title
- Surface emitting laser device
- Patent number
- US12731959B2
- Application number
- 18256423
- Filed
- Nov 8, 2021
- Granted
- Sep 8, 2026
- Inventors
- 6
- Claims
- 14
Classified under
H01S 5/04256 Electricity & electronicsH01S 5/0233 Electricity & electronicsH01S 5/423 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.