SpaceXPatent applicationChips & hardwareInterest 3/10

SpaceX patents method for adding metal parts to radio chips

Patent drawing from the official filing.

SpaceX describes a way to attach extra metal layers to radio frequency chips after they are made. This process adds passive electrical components, like inductors or capacitors, by connecting them to specific open areas on the chip's surface.

Why it mattersThis technique could help manufacturers improve the performance of radio chips used in communications hardware without redesigning the entire chip.

In the filing’s own words

Systems and techniques are provided for providing off-chip passive components for radio frequency (RF) integrated circuits. For example, a process can include obtaining an RFIC, wherein the RFIC comprises a semiconductor substrate, a metal layer disposed on a surface of the semiconductor substrate, and a passivation layer disposed on the surface of the semiconductor substrate and configured to prevent physical contact with the semiconductor substrate, wherein the passivation layer includes an exposed area. The process further includes adding an additional metal layer to the RFIC, wherein the additional metal layer contacts an exposed portion of the metal layer corresponding to the exposed area of the passivation layer, wherein the additional metal layer includes one or more passive electrical components.

What exactly they claim (claim 1)

1. A method of for providing off-chip passive components for radio frequency integrated circuits (RFICs), the method comprising: obtaining an RFIC, wherein the RFIC comprises: a semiconductor substrate; a metal layer disposed on a surface of the semiconductor substrate; and a passivation layer disposed on the surface of the semiconductor substrate and configured to prevent physical contact with the semiconductor substrate, wherein the passivation layer includes an exposed area; and adding an additional metal layer to the RFIC, wherein the additional metal layer contacts an exposed portion of the metal layer corresponding to the exposed area of the passivation layer, wherein the additional metal layer includes one or more passive electrical components.

Facts

Company: SpaceX (Space Exploration Technologies Corp.)
Official title: OFF-CHIP PASSIVE COMPONENTS FOR RADIO FREQUENCY INTEGRATED CIRCUITS
Publication number: US20260324441A1
Application number: 19463540
Filed: Jan 29, 2026
Published: Oct 15, 2026
Inventors: 3
Claims: 17

Classified under

H10W 44/248 Electricity & electronicsH01Q 1/2283 Electricity & electronicsH01Q 1/38 Electricity & electronicsH10P 50/28 Electricity & electronicsH10W 70/655 Electricity & electronicsH10W 90/724 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.