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MetaPatent applicationWearablesInterest 4/10

Meta patents wearable design that protects sensors with heat-resistant shields

Patent drawing
Patent drawing from the official filing.

Meta describes a method for embedding sensors inside a wearable device by covering them with a heat-resistant shield material. The design uses small holes in the outer layer to allow the sensors to detect data while keeping them protected within the device's body.

Why it mattersThis filing details a specific manufacturing technique that could help make future wearables more durable by better protecting internal components during production.

In the filing’s own words

A wearable device including one or more sensors and one or more through-holes extending from an exterior portion of the first material to an interior portion of the first material where the one or more sensors are embedded is described. The wearable device includes a first material. The wearable device further includes a shield material, the shield material having a heat tolerance greater than a heat tolerance of the first material. The wearable device further includes one or more sensors positioned beneath the shield material and embedded within an overmolded portion of the first material. The wearable device further includes a through-hole, extending from an exterior portion of the first material to an interior portion of the first material where the one or more sensors are embedded, wherein the one or more sensors detect data via the through-hole.

What exactly they claim (claim 1)

1. A wearable device comprising: a first material; a shield material, the shield material having a heat tolerance greater than a heat tolerance of the first material; one or more sensors positioned beneath the shield material and embedded within an overmolded portion of the first material; and a through-hole, extending from an exterior portion of the first material to an interior portion of the first material where the one or more sensors are embedded, wherein the one or more sensors detect data via the through-hole.

Facts

Company
Meta (Meta Platforms Technologies, LLC)
Official title
DESIGNS FOR ENCAPSULATING SENSOR COMPONENTS WITH OPENINGS FOR OPERATION AND METHODS OF MANUFACTURE THEREOF
Publication number
US20260319276A1
Application number
19635333
Filed
Mar 31, 2026
Published
Oct 15, 2026
Inventors
10
Claims
20

Classified under

G02C 11/10 Physics & computingH04R 1/028 Electricity & electronicsH04R 1/08 Electricity & electronicsH04R 2499/15 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.