Apple patents antenna layers glued directly to chip packages
Apple describes a design where an antenna is built in layers and stuck directly onto a chip package using an adhesive insulation layer. This setup connects the antenna's metal parts to the chip's internal wiring, eliminating the need for separate connection points.
In the filing’s own words
Electronic modules that include an antenna are described in accordance with embodiments. In an embodiment, the antenna includes an adhesive insulation layer, a patterned metal antenna layer over the adhesive insulation layer, and a protective layer over the patterned metal antenna layer. Further, the adhesive insulation layer of the antenna may be attached to an integrated circuit (IC) package structure, where the IC package structure may include an electronic component bonded to a routing layer and a gap fill material that encapsulates the electronic component. In such instances, the patterned metal antenna layer of the antenna may be electrically connected to the routing layer.
What exactly they claim (claim 1)
1. An electronic module comprising: a module substrate; an integrated circuit (IC) package structure mounted to the module substrate, the IC package structure including a routing layer, an electronic component bonded to the routing layer, and a gap fill material that encapsulates the electronic component; and an antenna attached to the IC package structure, the antenna including an adhesive insulation layer, a patterned metal antenna layer over the adhesive insulation layer and a protective layer over the patterned metal antenna layer, wherein the patterned metal antenna layer is electrically connected to the routing layer.
Facts
- Company
- Apple (Apple Inc.)
- Official title
- Multi-Layer Antenna
- Publication number
- US20260302623A1
- Application number
- 19094299
- Filed
- Mar 28, 2025
- Published
- Oct 1, 2026
- Inventors
- 11
- Claims
- 20
Classified under
H01Q 9/0414 Electricity & electronicsMore from Apple in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.