Google patents ultra-thin film leads for brain implants
This filing describes a method for making very thin, flexible wires used in brain implants. The design uses a supporting structure with specific features to help it stick securely to a backing layer during manufacturing.
In the filing’s own words
The present disclosure relates to thin-film lead assemblies and neural interfaces, and methods of microfabricating thin-film lead assemblies and neural interfaces. Particularly, aspects of the present disclosure are directed to a thin-film neural interface that includes a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, one or more of conductive traces formed on a portion of the supporting structure, one or more electrodes formed on the front side of the supporting structure in electrical connection with the one or more conductive traces, and a backing formed on the back side of the supporting structure. The supporting structure comprises one or more features to facilitate mechanical adhesion between the supporting structure and the backing.
What exactly they claim (claim 1)
1. (canceled)
Facts
- Company
- Google (Verily Life Sciences LLC)
- Official title
- THIN-FILM LEAD ASSEMBLIES AND NEURAL INTERFACES
- Publication number
- US20260294347A1
- Application number
- 19571799
- Filed
- Mar 19, 2026
- Published
- Oct 1, 2026
- Inventors
- 3
- Claims
- 21
Classified under
A61B 5/6868 Human necessitiesA61N 1/0529 Human necessitiesA61N 1/0551 Human necessitiesH10K 10/471 Electricity & electronicsH10K 85/1135 Electricity & electronicsH10K 85/731 Electricity & electronicsMore from Google in Health & body
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
