Apple patents stacked chip design with molded plastic steps
Apple describes a method for building electronic packages by stacking components on top of each other. The design uses a molded plastic layer with a stepped shape to hold the chips, with wiring running across the steps and through holes to connect the layers.
In the filing’s own words
Electronic packages and methods of formation are described. In an embodiment, an electronic package includes one or more electronic components encapsulated in a step molded molding compound layer, and wiring layer spanning a lower step surface, sidewall, and top surface of the step molded molding compound layer. The wiring layer may further extend into a via opening extending through the lower step surface of the molding compound layer.
What exactly they claim (claim 1)
1. An electronic package comprising: a first-level routing layer; a first-level electronic component on the first-level routing layer; a first-level molding compound layer that encapsulates the first-level electronic component on the first-level routing layer, the first-level molding compound layer including a top surface, a lower step surface and a sidewall spanning between the top surface and the lower step surface; a first-level via opening extending through the lower step surface of the first-level molding compound layer to the first-level routing layer; a second-level wiring layer on the first-level molding compound layer and spanning the lower step surface, the sidewall, and the top surface of the first-level molding compound layer; and a second-level electronic component mounted on the second-level wiring layer.
Facts
- Company
- Apple (Apple Inc.)
- Official title
- Electronic package molded vertical interconnection
- Patent number
- US12772885B2
- Application number
- 18469243
- Filed
- Sep 18, 2023
- Granted
- Oct 20, 2026
- Inventors
- 4
- Claims
- 22
Classified under
H10W 70/65 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 74/01 Electricity & electronicsH10W 74/121 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/701 Electricity & electronicsMore from Apple in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.