Amazon patents modular radio chips that swap wireless standards
Amazon describes a wireless design where small, identical radio modules handle different communication standards like Wi-Fi or Bluetooth. These modules connect to central processors, allowing manufacturers to mix and match hardware pieces instead of building one large chip.
In the filing’s own words
Technologies related to wireless connectivity architectures with tile radio frequency (RF) integrated circuits are described. A wireless communication subsystem includes multiple RF tiles, each of the RF tiles including identical hardware comprising a first serializer/deserializer (SerDes) interface circuit and at least two radio frequency front-end (RFFE) circuits. Each of the at least two RFFE circuits corresponding to one of multiple radio technologies. The wireless communication subsystem includes multiple baseband processors. Each of the baseband processors implementing one of the radio technologies. The wireless communication subsystem also includes a second SerDes interface circuit coupled between the baseband processors and the first SerDes interface circuit of each of the RF tiles.
What exactly they claim (claim 1)
1. A wireless device comprising: a radio frequency integrated circuit (RFIC) comprising: a first radio frequency tile (RF tile) with first data converters and a first radio frequency front-end (RFFE) circuit for a first radio technology, second data converters and a second RFFE circuit for a second radio technology, a first modem for the second radio technology, a first serializer/deserializer (SerDes) interface circuit, and a first serial peripheral interface (SPI) circuit; and a second RF tile with third data converters and a third RFFE circuit for the first radio technology, fourth data converters and a fourth RFFE circuit for the second radio technology, a second modem for the second radio technology, a second SerDes interface circuit, and a second SPI circuit; and a modem integrated circuit (IC) operatively coupled to the RFIC, wherein the modem IC comprises: a third SerDes interface circuit operatively coupled to the first and second SerDes interface circuits; a first baseband processor for the first radio technology; a first controller for the first radio technology; a second baseband processor for the second radio technology; and a second controller for the second radio technology.
Facts
- Company
- Amazon (Amazon Technologies, Inc.)
- Official title
- Wireless connectivity architecture with tile radio frequency (RF) front-end circuitry
- Patent number
- US12769697B1
- Application number
- 18807725
- Filed
- Aug 16, 2024
- Granted
- Oct 20, 2026
- Inventors
- 1
- Claims
- 20
Classified under
G06F 13/4282 Physics & computingG06K 19/0723 Physics & computingG06F 2213/0002 Physics & computingMore from Amazon in Chips & hardware
- Amazon patents using metal frames to send data between devices Sep 1, 2026
- Amazon patents flexible mat that detects when items are placed or removed Sep 15, 2026
- Amazon patents hardware chip that watches memory for security threats Sep 29, 2026
- Amazon patents chip design that simplifies AI math steps Oct 13, 2026
- Amazon patents tool to auto-update chip test scripts Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.