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SonyGranted patentCameras & imagingInterest 4/10

Sony patents camera sensor design with rounded edges for better image quality

Patent drawing
Patent drawing from the official filing.

Sony describes a structure for camera sensors that places a special coating between the sensor chip and the protective glass frame. This coating reduces unwanted reflections and supports the glass while keeping the light-sensitive area clear.

Why it mattersThis design aims to improve the clarity of photos taken by smartphones and other devices by managing how light hits the sensor.

In the filing’s own words

The present disclosure relates to an imaging element package and an electronic device that allow images to be captured with better quality. A support portion configured to support a cover glass that protects a light-receiving surface of a semiconductor substrate provided with a photodiode is provided along an outer periphery of the semiconductor substrate, and an antireflection layer is provided between the support portion and the semiconductor substrate at least in an area where the support portion is provided. The antireflection layer is provided entirely on the light-receiving surface of the semiconductor substrate, and the support portion is stacked on the antireflection layer. The present disclosure can be applied to a CMOS image sensor, for example.

What exactly they claim (claim 1)

1. An imaging element package, comprising: a semiconductor substrate provided with a photodiode; a support portion provided along an outer periphery of the semiconductor substrate to support a cover glass that protects a light-receiving surface of the semiconductor substrate; an antireflection layer provided between the support portion and the semiconductor substrate at least in an area where the support portion is provided; and a light-shielding layer provided stacked on the antireflection layer with a prescribed width outwardly from a boundary between an effective pixel area where pixels effectively used for capturing images are located and a peripheral area provided in a peripheral part outside of the effective pixel area, wherein the light-shielding layer has an outer shape having four corners rounded in an arc shape with a prescribed radius of curvature when viewed in a plan view, wherein the antireflection layer is provided entirely on the light-receiving surface of the semiconductor substrate, and wherein the support portion is stacked on the antireflection layer.

Facts

Company
Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Official title
Imaging element package and electronic device
Patent number
US12765094B2
Application number
18566150
Filed
May 23, 2022
Granted
Oct 13, 2026
Inventors
8
Claims
18

Classified under

H10F 39/805 Electricity & electronicsH04N 25/79 Electricity & electronicsH10F 39/182 Electricity & electronicsH10F 39/804 Electricity & electronicsH10F 39/8057 Electricity & electronicsH10F 39/8063 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.