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AppleGranted patentChips & hardwareInterest 4/10

Apple patents chip cutting method to prevent peeling

Apple has been granted a patent for a method of cutting computer chips that involves creating a small groove along the side of the chip before the final cut. This groove removes the edge of the chip where two parts are glued together, which helps prevent the layers from separating or peeling off during the manufacturing process.

Why it mattersThis technique improves the reliability of chip manufacturing by addressing a common issue where bonded layers can fail at the edges, potentially leading to more durable electronic components.

In the filing’s own words

Integrated circuit (IC) structures, electronic modules, and methods of fabrication are described in which direct bonded interfaces are removed at corners or edges to counteract the potential for non-bonding or delamination. This can be accomplished during singulation, in which a side recess is formed through an entire thickness of an electronic component and into a direct bonded die, followed by final singulation of the IC structure.

What exactly they claim (claim 1)

1. An integrated circuit structure comprising: an electronic component including a first bonding surface; a die including a second bonding surface bonded directly to the first bonding surface; a side recess extending through an entire thickness of the electronic component and into the die; wherein the side recess defines a recess sidewall extending through the entire thickness of the electronic component and a recess roof within the die; and wherein the recess roof intersects with an outermost lateral sidewall of the die such that the outermost lateral sidewall is exterior to the recess sidewall.

Facts

Company
Apple (Apple Inc.)
Official title
Chip singulation assisted structures and methods for improving bonding interface quality
Patent number
US12745681B2
Application number
18598938
Filed
Mar 7, 2024
Granted
Sep 22, 2026
Inventors
11
Claims
34

Classified under

H10W 90/00 Electricity & electronicsH10D 62/117 Electricity & electronicsH10W 20/43 Electricity & electronicsH10W 42/00 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 70/65 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.