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AppleGranted patentChips & hardwareInterest 4/10

Apple patents chip packaging method using conductive film instead of solder

Apple describes a way to build larger electronic packages by connecting an interposer layer to a base substrate using a conductive film rather than traditional solder. The filing details how these layers are stacked and joined during manufacturing to create a stable connection for computer chips.

Why it mattersThis technique allows manufacturers to create larger, more complex chip packages, which is essential for building high-performance processors used in phones and computers.

In the filing’s own words

Electronic packages and methods of formation are described in which an interposer is solderlessly connected with a package substrate. The interposer may be stacked on the package substrate and joined with a conductive film, and may be formed on the package substrate during a reconstitution sequence.

What exactly they claim (claim 1)

1. An electronic package comprising: a package substrate that has a first maximum width in a first direction between first laterally opposite edges of the package substrate; an organic interposer bonded to the package substrate with a conductive film to electrically connect a plurality of contact pads of the organic interposer to a corresponding plurality of landing pads of the package substrate; wherein the organic interposer includes a plurality of polymer dielectric layers, a first plurality of first metal redistribution lines, and a lower rigid layer that is thicker than each of the plurality of polymer dielectric layers or is formed of a different material than each of the plurality of polymer dielectric layers; wherein the organic interposer has a second maximum width in the first direction between second laterally opposite edges of the organic interposer, and the second maximum width is less than the first maximum width; wherein the conductive film includes an electrically conductive material dispersed in an adhesive insulator matrix; and one or more dies bonded to a top side of the organic interposer.

Facts

Company
Apple (Apple Inc.)
Official title
Scalable extreme large size substrate integration
Patent number
US12745661B2
Application number
17815893
Filed
Jul 28, 2022
Granted
Sep 22, 2026
Inventors
4
Claims
14

Classified under

H10W 70/695 Electricity & electronicsH10W 72/0198 Electricity & electronicsH10W 72/20 Electricity & electronicsH10W 74/00 Electricity & electronicsH10W 74/016 Electricity & electronicsH10W 90/00 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.