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Sony patents camera sensor design that blocks stray light from hitting circuits

Sony has been granted a patent for a camera sensor that combines a light-capturing chip with a processing chip. The design includes a specific metal wiring layer that acts as a shield to block stray light from reaching the electronic components underneath.

Why it mattersThis technical improvement helps prevent light interference in camera sensors, which can lead to clearer images in standard photography.

In the filing’s own words

A solid-state imaging element according to the present disclosure is provided with a first substrate (light reception chip) and a second substrate (detection chip). The first substrate (light reception chip) is provided with a photodiode that photoelectrically converts incident light to generate a photocurrent. The second substrate (detection chip) is provided with a luminance change detection circuit (current-voltage conversion circuit) that detects a change in luminance of the incident light on the basis of a voltage signal converted by a conversion circuit (current-voltage conversion circuit) that converts the photocurrent into the voltage signal, and is bonded to the first substrate (light reception chip). A light shielding unit (light shielding film) provided in at least any one of the first substrate (light reception chip) or the second substrate (detection chip) and shields light between an active element (transistor TR) provided in the second substrate (detection chip) and the photodiode is included.

What exactly they claim (claim 1)

1. A solid-state imaging element, comprising: a first substrate including a photodiode configured to photoelectrically convert incident light into a photocurrent; a second substrate including a conversion circuit configured to convert the photocurrent into a voltage signal and a luminance change detection circuit configured to detect a change in luminance of the incident light based on the voltage signal, wherein the second substrate is bonded to the first substrate; and a light shielding unit that is provided in the first substrate and the second substrate and shields light between an active element provided in the second substrate and the photodiode, wherein the light shielding unit includes a light shielding wiring provided in a second wiring layer provided between a semiconductor layer of the second substrate that includes the active element and the first substrate, wherein the light shielding wiring extends beyond the active element in a horizontal direction such that a portion of the light shielding wiring does not overlap the active element in a plan view, and wherein a horizontal length of the non-overlapping portion of the light shielding wiring is greater than a vertical length between the light shielding wiring and the active element.

Facts

Company
Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Official title
Solid-state imaging element and imaging system
Patent number
US12745469B2
Application number
17796896
Filed
Feb 2, 2021
Granted
Sep 22, 2026
Inventors
6
Claims
20

Classified under

H10F 39/8057 Electricity & electronicsH10F 39/18 Electricity & electronicsH10F 39/8063 Electricity & electronicsH10F 39/809 Electricity & electronicsH10F 39/811 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.