Apple patents titanium and metal housing with thin bonding layer
Apple describes a housing for electronic devices that combines an outer titanium shell with an inner metal structure. The two different metals are joined by a microscopic layer of intermetallic compound, which is thinner than a micrometer and free of oxide particles.
In the filing’s own words
A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.
What exactly they claim (claim 1)
1. A housing for an electronic device, comprising: an exterior titanium portion; an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion; and an intermetallic compound layer having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion; wherein the intermetallic compound layer is free of discrete oxide particles.
Facts
- Company
- Apple (Apple Inc.)
- Official title
- Electronic device including clad components
- Patent number
- US12739995B2
- Application number
- 18461458
- Filed
- Sep 5, 2023
- Granted
- Sep 15, 2026
- Inventors
- 8
- Claims
- 19
Classified under
H05K 5/04 Electricity & electronicsB32B 15/017 Operations & transportG06F 1/1656 Physics & computingH05K 5/0086 Electricity & electronicsMore from Apple in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.