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AppleGranted patentChips & hardwareInterest 4/10

Apple patents titanium and metal housing with thin bonding layer

Apple describes a housing for electronic devices that combines an outer titanium shell with an inner metal structure. The two different metals are joined by a microscopic layer of intermetallic compound, which is thinner than a micrometer and free of oxide particles.

Why it mattersThis design could improve the durability or manufacturing process of device casings by allowing different metals to bond securely without weak spots.

In the filing’s own words

A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.

What exactly they claim (claim 1)

1. A housing for an electronic device, comprising: an exterior titanium portion; an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion; and an intermetallic compound layer having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion; wherein the intermetallic compound layer is free of discrete oxide particles.

Facts

Company
Apple (Apple Inc.)
Official title
Electronic device including clad components
Patent number
US12739995B2
Application number
18461458
Filed
Sep 5, 2023
Granted
Sep 15, 2026
Inventors
8
Claims
19

Classified under

H05K 5/04 Electricity & electronicsB32B 15/017 Operations & transportG06F 1/1656 Physics & computingH05K 5/0086 Electricity & electronics

More from Apple in Chips & hardware

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.