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Apple patents touch screen design that shrinks the sensor size

Apple describes a touch sensor panel that uses two conductive layers and a separate printed circuit board to handle touch signals. The design connects the touch electrodes to the control circuitry through a specific bonding region, allowing the overall sensor panel to be made smaller.

Why it mattersThis design could help manufacturers create thinner or more compact touch screens for devices like phones and tablets.

In the filing’s own words

Disclosed herein is a touch sensor panel including a substrate, a plurality of conductive layers including a first conductive layer and a second conductive layer, a plurality of vias from the first conductive layer to the second conductive layer, and control circuitry mounted to a printed circuit. The control circuitry can include touch sensing circuitry. The first conductive layer can include a plurality of touch electrodes. The second conductive layer can be separated from the substrate by at least the first conductive layer and can include a bonding region with a plurality of bond pads for interconnection with the plurality of touch electrodes. The printed circuit can be separated from the substrate by at least the plurality of conductive layers and can be bonded to the plurality of bond pads by a conductive bonding material between the second conductive layer and the printed circuit.

What exactly they claim (claim 1)

1. A touch sensor panel, comprising: a substrate; a plurality of conductive layers including a first conductive layer and a second conductive layer; a plurality of vias from the first conductive layer to the second conductive layer; and control circuitry mounted to a printed circuit; wherein: the control circuitry includes touch sensing circuitry; the first conductive layer includes a plurality of touch electrodes; the touch sensor panel includes a plurality of force electrodes disposed on a layer of the plurality of conductive layers different than the first conductive layer; the second conductive layer is separated from the substrate by at least the first conductive layer and includes a bonding region with a plurality of bond pads for interconnection with the plurality of touch electrodes; and the printed circuit is separated from the substrate by at least the plurality of conductive layers and is bonded to the plurality of bond pads by a conductive bonding material between the second conductive layer and the printed circuit.

Facts

Company
Apple (Apple Inc.)
Official title
Touch sensor panel with reduced dimensions
Patent number
US12737086B2
Application number
18892135
Filed
Sep 20, 2024
Granted
Sep 15, 2026
Inventors
6
Claims
20

Classified under

G06F 3/0445 Physics & computingG06F 3/04144 Physics & computingG06F 3/04164 Physics & computing
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.