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SonyGranted patentCameras & imagingInterest 6/10

Sony patents stacked camera sensor design with vertical wiring

Sony describes a camera sensor where multiple light-detecting layers are stacked on top of each other. Each layer is designed to pick up different colors of light, and they are connected by vertical wires that run straight down to the base.

Why it mattersThis design could lead to thinner camera sensors that capture more detailed color information, which is useful for high-end cameras and smartphones.

In the filing’s own words

A solid-state imaging device according to an embodiment of the present disclosure includes: a plurality of photoelectric converters that is stacked on a semiconductor substrate, and has wavelength selectivities different from each other; and a wiring line that is formed on the semiconductor substrate, and is electrically coupled to the plurality of photoelectric converters. Each of the photoelectric converters includes a photoelectric conversion film, and a first electrode and a second electrode that are disposed with the photoelectric conversion film interposed therebetween. The wiring line extends in a direction normal to the semiconductor substrate, and includes a vertical wiring line formed in contact with the second electrode of each of the photoelectric converters.

What exactly they claim (claim 1)

1. A solid-state imaging device comprising: a plurality of photoelectric converters that is stacked on a semiconductor substrate, and has wavelength selectivities different from each other; and a wiring line that is formed on the semiconductor substrate, and is electrically coupled to the plurality of photoelectric converters, wherein each of the photoelectric converters includes a photoelectric conversion film, and a first electrode and a second electrode that are disposed with the photoelectric conversion film interposed therebetween, the wiring line extends in a direction normal to the semiconductor substrate, and includes a vertical wiring line formed in contact with the second electrode of each of the photoelectric converters, a first sealing film is in contact with the first electrode of a first photoelectric converter, and a second sealing film is in contact with the first electrode of a second photoelectric converter, and the first sealing film and the second sealing film have junction surfaces, which are surfaces of the first sealing film and the second sealing film that face each other, joined to each other by predetermined junction processing between the first and second sealing films, and at least the first photoelectric converter and the second photoelectric converter have a layer order which is line-symmetric across the junction surfaces.

Facts

Company
Sony (SONY GROUP CORPORATION)
Official title
Solid-state imaging device and method of manufacturing solid-state imaging device
Patent number
US12733331B2
Application number
17778227
Filed
Nov 12, 2020
Granted
Sep 8, 2026
Inventors
8
Claims
13

Classified under

H10K 39/32 Electricity & electronicsH04N 25/70 Electricity & electronicsH10F 39/018 Electricity & electronicsH10F 39/12 Electricity & electronicsH10F 39/804 Electricity & electronicsH10F 39/805 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.